Summer School: ‘Algorithms and green chips for Artificial Intelligence’

The USC-Televés Chair of Microelectronics will hold its Summer School from July 7 to 11, 2025 at the Research Center for Intelligent Technologies (CiTIUS). This event, lasting a total of 28 teaching hours, is aimed at master's and doctoral students, young researchers and professionals in the sector. The program is completely free, as the USC-Televés Chair covers the entire cost for the participants.

The objectives of this course are: to train in new computing paradigms for artificial intelligence, to disseminate green computing strategies, and to learn about new emerging devices for in-memory computing combined with new AI training models.

The program includes lectures and practical demonstrations given by distinguished experts in multiple areas, such as image recognition, in-memory computing, or linguistic technologies. Among the speakers are representatives from companies and institutions such as Maxwell Applied Technologies, IBM, Fondazione Bruno Kessler, the University of Barcelona, the Polytechnic University of Turin, INL, and CiTIUS, among others. You can check here for the complete list of participants, as well as the schedule of the school's activities.

The Summer School has 50 available spots and is recognized with 2 ECTS credits. Pre-registration and enrollment will be open until June 27 and can be done at this link.

For more information, you can visit the official website of the Summer School.

About the Chair

The USC-Televés Chair of Microelectronics is a strategic collaboration between the company Televés and the Universidade de Santiago de Compostela through CiTIUS, a research center co-financed by the European Union through the Galicia Feder Program 2021-2027. The goal of this chair is to promote research in microchips and microelectronic design. This initiative addresses key challenges in the microelectronics sector, highlighting the research lines proposed in the areas of Edge Computing, In-Memory Computing, Quantum Computing, and advancements in cutting-edge chips for AESA (Active Electronically Scanned Array) systems.