Optimization of thermionic cooling semiconductor heterostructures with deep learning techniques
Author/s: Julian G. Fernandez, Guéric Etesse, Enrique Comesaña, Natalia Seoane, Xiangyu Zhu, Kazuhiko Hirakawa, Antonio Garcia-Loureiro, and Marc Bescond
Congress · 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). Kobe, Japan. 2023